A collaboration between computing giant IBM and silicon developer RF Micro Devices could result in a tinier, more powerful generation of mobile phones, the companies said yesterday.

The two firms plan to work together to develop radio frequency integrated circuits (RFICs) based on IBM's silicon germanium (SiGe) technology. The project is expected to reduce the number of chips required in upcoming wireless handsets which would simplify manufacturing resulting in smaller phones with a longer battery life than current designs.

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