11 Aug 2008 15:25
CNET Networks's TechRepublic runs a regular series called 'Cracking Open' in which it takes a look inside a variety of gadgets. ZDNet.co.uk is publishing this excerpt.
From the front, the iPhone 3G looks almost identical to the original iPhone, which we cracked open in 2007. Here you see the screen, speaker and home button.
According to Apple's technical specifications, the iPhone 3G is 4.5 inches high, 2.4 inches wide and 0.48 inches deep. It weighs 133 grams. The phone's multitouch display offers 480-by-320-pixel resolution at 163ppi. The iPhone 3G is almost identical to the original iPhone in size and weight.
The iPhone 3G has an accelerometer, proximity sensor and ambient light sensor.
Lifting up the display, we get our first look inside the iPhone 3G.
Small, orange stickers were used to number the connection to the main PCB board.
Unlike the first iPhone, the iPhone 3G's LCD and front cover are separate pieces, like in the iPod Touch.
These connectors attach the LCD, touch sensors and ear speaker to the main PCB.
Looking through the clear front cover, you can see just how easily the iPhone 3G's front cover can be smudged.
With the LCD and front cover completely removed, we get our first good look at the iPhone 3G's internal components.
Unlike the first iPhone, the iPhone 3G's main PCB handles both logic and communication. The first iPhone contained separate logic and communication boards that were stacked inside the case.
As previously mentioned, the iPhone 3G has a single PCB to handle logic and communication.
The board has two sections, each covered by a separate electromagnetic-interference (EMI) shield. The camera is attached to the top of board.
Like its predecessor, the iPhone 3G has a 2-megapixel camera.
With the main PCB removed, we can see the iPhone 3G's battery (centre) and the small PCB, which contains the docking connector and headphone jack (right side).
The iPhone 3G's battery connects to the main PCB via these four contact points.
The docking port and headphone jack are removed as a single piece.
With both EMI shields removed, we can see the chips used in the iPhone 3G.
Apple uses components from Intel, Samsung, ARM, SST, Skyworks, TriQuint Semiconductor, and Infineon.
Here we have a great view of the iPhone 3G's chips.
Here are the iPhone 3G SIM slot (left) and SST SST25VF040B 4Mb SPI Serial Flash (right).
It took us about four hours to completely disassemble the iPhone 3G and shoot the photographs. Compared with the original iPhone, the iPhone 3G was much easier to take apart.
As always, we disassembled the iPhone 3G with the intention of reassembling it in working order. The device did indeed work when we put it back together.
However, the typical user should probably avoid cracking it open.
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