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WorkSmart - Manage your career, job accomplishm... 2.0

WorkSmart - Manage your career, job accomplishm... 2.0

...recorded, formatted, and ready to show my manager." Kevin N Lam, ASIC, Chip, Package Design, Signal-integrity, & Methodology GuruTraveling is a large part of my... Read more

8 February, 2012
WorkSmart Lite - Manage your career, job accomplishments, and business goals 1.0

WorkSmart Lite - Manage your career, job accomplishments, and business goals 1.0

...recorded, formatted, and ready to show my manager." Kevin N Lam, ASIC, Chip, Package Design, Signal-integrity, & Methodology GuruTraveling is a large part of my... Read more

22 July, 2011

Packing chips in yields slimmer phones

Toshiba has unveiled a chip package for cellphones that can hold up to nine chips, which the... Read more

22 January, 2004 by Michael Kanellos
Integration of Grid Array Antenna in <endeca_term>Chip Package</endeca_term> for Highly Integrated 60-GHz Radios

Integration of Grid Array Antenna in Chip Package for Highly Integrated 60-GHz Radios

...Package (AiP) technology that integrates an antenna (or antennas) in a radio chip package has become a key technology for 60-GHz wireless communications. However... Read more

26 February, 2010
ISAC: Integrated Space and Time Adaptive <endeca_term>Chip-Package</endeca_term> Thermal Analysis

ISAC: Integrated Space and Time Adaptive Chip-Package Thermal Analysis

...must be embedded within IC synthesis. However, this requires accurate three-dimensional chip-package heat flow analysis. This has typically been based on numerical methods... Read more

26 August, 2006
Design and Integration of 60-GHz Grid Array Antenna in <endeca_term>Chip Package</endeca_term>

Design and Integration of 60-GHz Grid Array Antenna in Chip Package

Driven by the great potential to revolutionize short-range high-speed wireless personal area network systems, designs... Read more

3 March, 2010
Octilinear Redistributive Routing in Bump Arrays

Octilinear Redistributive Routing in Bump Arrays

...scheme for automatic Re-Distribution Layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed manually because the... Read more

12 May, 2009
Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design

Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design

Chip-package thermal analysis is necessary for the design and synthesis of reliable... Read more

9 November, 2006

Tessera aims to wrap up IPO

...changed the sport. In the early days of the semiconductor market, a chip package might contain two or four electrical leads (for connecting the chip... Read more

30 October, 2003 by Michael Kanellos
Oracle cuts fees in multicore shift

Oracle cuts fees in multicore shift

...processing engines on a single slice of silicon or in a single chip package. The company already has changed course twice because of new chip... Read more

2 March, 2007 by Stephen Shankland
AMD makes bold quad-core claims

AMD makes bold quad-core claims

...chip with four cores rather than using Intel's dual-core, dual-chip package approach. AMD calls its approach "monolithic" or "native" quad core. Customers... Read more

24 January, 2007 by Stephen Shankland

Photos: Inside IBM's Zurich research lab

...all in the packaging -- Dr Michel's team are working on a chip package that puts a thermal paste directly on the processor and then... Read more

22 May, 2006 by Colin Barker

Does AMD have a case?

...complaint allege that bundling discounts offered as part of Intel's Centrino chip package for notebooks, which debuted in 2003, have also harmed AMD. But... Read more

29 June, 2005 by Michael Kanellos

Intel sees low-end PCs going for a song

The Intel Express 910GL is aimed at allowing PC makers the option to add high-end audio features to low-end PCs Read more

23 September, 2004 by John G.Spooner

Intel asks for a little Linux help with Centrino

A year after it launched its Centrino chip package for building notebooks with wireless networking abilities, Intel has begun a... Read more

11 March, 2004 by Stephen Shankland

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