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A Gate Level Sensor Network for <endeca_term>Integrated Circuits</endeca_term> Temperature Monitoring

A Gate Level Sensor Network for Integrated Circuits Temperature Monitoring

The authors present the first sensor network architecture to monitor Integrated Circuits (IC) thermal and energy activity. The sensor network consists of a... Read more

13 January, 2011
Design and Evaluation of Mesh-of-Tree Based Network-on-Chip for Two- and Three-Dimensional <endeca_term>Integrated Circuits</endeca_term>

Design and Evaluation of Mesh-of-Tree Based Network-on-Chip for Two- and Three-Dimensional Integrated Circuits

This paper presents an in-depth study of Mesh-of-Tree (MoT) topology and its application in Network-on-Chip (NoC) design... Read more

1 February, 2011
Lane Decoupling for Improving the Timing-Error Resiliency of Wide-SIMD Architectures

Lane Decoupling for Improving the Timing-Error Resiliency of Wide-SIMD Architectures

A significant portion of the energy dissipated in modern integrated circuits is consumed by the overhead associated with timing guard-bands that... Read more

15 April, 2012
Integrated Circuit Digital Rights Management Techniques Using Physical Level Characterization

Integrated Circuit Digital Rights Management Techniques Using Physical Level Characterization

Digital Rights Management (DRM) of Integrated Circuits (ICs) is a crucially important task both economically and strategically. Several... Read more

21 October, 2011
Matched Public PUF: Ultra Low Energy Security Platform

Matched Public PUF: Ultra Low Energy Security Platform

Hardware-based Physically Unclonable Functions (PUFs) leverage intrinsic process variation of modern integrated circuits to provide interesting security solutions but either induce high storage requirements... Read more

25 June, 2011
Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs

Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs

Pre-bond testing of 3-D stacked Integrated Circuits (ICs) involves testing each individual die before bonding. The overall yield... Read more

1 May, 2011
The Fast Optimal Voltage Partitioning Algorithm for Peak Power Density Minimization

The Fast Optimal Voltage Partitioning Algorithm for Peak Power Density Minimization

Increasing transistor density in nanometer integrated circuits has resulted in large on-chip power density. As a high... Read more

29 November, 2010
Multiple Vdd on 3D NoC Architectures

Multiple Vdd on 3D NoC Architectures

The communication problem is a challenge issue for Integrated Circuits (ICs), which usually becomes a bottleneck for performance improvement. Three-Dimensional... Read more

21 November, 2010
A Review of Wireless Body Area Networks for Medical Applications

A Review of Wireless Body Area Networks for Medical Applications

Recent advances in Micro-Electro-Mechanical Systems (MEMS) technology, integrated circuits, and wireless communication have allowed the realization of Wireless Body Area... Read more

3 August, 2010
System-on-Chip: Reuse and Integration

System-on-Chip: Reuse and Integration

Over the past ten years, as integrated circuits became increasingly more complex and expensive, the industry began to embrace... Read more

16 June, 2010
LayoutEditor 20120420

LayoutEditor 20120420

...Chip-on-Board (COB), Low temperature co-fired ceramics (LTCC), Monolithic Microwave Integrated Circuits (MMIC), printed circuit boards (PCB), GDS Editor thick film technology, thin... Read more

20 April, 2012

Fujitsu hints at scale-out storage technology

...controllers based around standard x86 chips rather than the custom application-specific integrated circuits or field-programmable gate arrays used in other controller designs, he... Read more

8 March, 2012

Cisco taps Lightwire for optical interconnects

...CoreOptics, a designer of coherent digital signal-processing solutions and application-specific integrated circuits for high-speed optical networking applications," Ned Hooper, Cisco's chief... Read more

24 February, 2012

Huawei orders $6bn worth of US hardware

...on the company's broadband and Snapdragon processors. Avago makes application-specific integrated circuits and other semiconductors. In Huawei's statement, an Avago executive highlighted... Read more

20 February, 2012

US academics develop self-healing circuits

...themselves after a catastrophic failure. "Thermomechanical failure of conductive pathways in highly integrated circuits results in loss of function that is often impossible to repair... Read more

22 December, 2011

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