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New Filter For Mobile Phones In Flip Chip Package
White Papers To meet these requirements, STMicroelectronics has created the EMIF10, a highly integrated 10-line low-pass filter in a revolutionary small flip-chip package - the equivalent of 70 discrete components on less than 7 mm2!
[May 7, 2004, 0:00]
Bumper Share Options Package For New UK Chip Boss
News British microchip designer ARC International revealed on Tuesday that its new chief executive has been awarded an incentive package of 10 million share options. According to the Financial Times, the package is one of the biggest ever in the...
[January 2, 2002, 16:35]
Packing Chips In Yields Slimmer Phones
News Toshiba has unveiled a chip package for cellphones that can hold up to nine chips, which the company says will give manufacturers greater flexibility when building handhelds. Toshiba is a licensee of Tessera's technology, but said it developed the...
[January 22, 2004, 10:20]
Intel Stacks Up On Memory
News The new package, called the Ultra-Thin Stacked Chip Scale Package, lets manufacturers stack up to five memory chips on top of each other, said Scott Dunagan, Intel's product marketing manager. The five-chip stack, in fact, measures only 1...
[April 10, 2003, 8:00]
Intel Crams More Memory Into Mobiles
News Intel is coming out with a new chip package that will let cellphone makers put far more memory into handsets, which is a key ingredient for transforming phones into minicomputers. One chip can be reserved for storing the operating system and phone...
[October 14, 2003, 8:45]
Design, Modeling And Characterization Of Embedded Capacitors For Decoupling Applications
White Papers The effect of chip, package and board capacitors on the performance of digital systems is analyzed taking into account the parasitic effects of power/ground planes, vias and solder balls. On-chip capacitance provides decoupling above 2GHz.
[March 7, 2007, 0:00]
Focus: Processor Makers' Flippin' Genius
News The "flip-chip" part of the package has to do primarily with heat dissipation. When Advanced Micro Devices (AMD) in the next few weeks introduces its new Duron microprocessor, the chip will be faster and cheaper partly because of a prosaic-sounding...
[May 2, 2000, 9:11]
Intel To Reveal Chip-packing Breakthrough
News How the chip fits into the package will also change. With BBUL, the chip will be embedded entirely in the package because the package will be grown around the chip through the same lithographic principles used to build the chips in the first place.
[October 8, 2001, 10:06]
Intel Gets Optical With Fibre
News That's slower than conventional optical technology -- and even some standard connections in PCs today -- but the entire unit is housed inside a chip package and should be cheaper than current optical parts.
[March 1, 2004, 14:25]
Tessera Aims To Wrap Up IPO
News Drawing on statistics from Tessera, market research company Gartner says the market for chip scale packaging, the basic package Tessera invented, should grow from 4.4 billion units in 2002 to 18.9 billion units in 2006, representing a compound...
[October 30, 2003, 14:45]
New Chipsets Underpin Intel's Latest Desktop PC Platform review
Reviews This presents the chip's connections as a grid of conductors flush with the bottom of the case -- a technique previously used on the Pentium II core. Intel is introducing its Matrix Storage Technology with this chipset -- strictly speaking, with...
[June 19, 2004, 8:30]
AMD Renews Cheap Chip Attack
News Advanced Micro Devices (AMD) is set to renew its focus on the "value" PC market with next month's release of Duron, a repackaging of its core Athlon chip technology with a few tricks to make it cheaper to manufacture.
[May 22, 2000, 15:03]
Intel Delays Launch Of Recalled PIII
News Intel has plans to transition the chip to its newer 370 pin socket FC-PGA package, otherwise known as flip chip, next year. Intel is gearing up to launch its next-generation Pentium 4 chip as soon as next month, but the chip maker won't ship its...
[October 11, 2000, 15:23]
Intel Boosts Software Radios
News Intel bundled its chip technology into a system-in-a-package design, which lowers the voltages required and extends battery life. The system-in-a-package also can be integrated into a device at a lower cost, the chip giant noted.
[June 20, 2005, 11:55]
Chips To Talk Without Wires
News In part, the problem arises from how the chip connections are built. The technology, called "proximity communication," aims to let one chip transmit signals directly to another next to it, instead of through the tangle of pins, wires and circuit...
[August 3, 2004, 8:50]
Preview: Intel Developer Forum
News The definition of "dual-core processor", however, is broad and ranges from a single chip in which the two integrated cores share resources to something that consists of two functionally and physically separate pieces of silicon that happen to be...
[February 25, 2005, 16:40]
Intel Shaves Mobile Chip Prices
News A few months after that release, Intel intends to add a delayed wireless 802.11 a/b chip of its own making into the Centrino package. The Centrino bundle includes a brand-new chip, code-named Banias, built especially for notebooks.
[January 14, 2003, 7:48]
Microprocessors Turn 30
News While the 4004 became the first microprocessor, Intel's total package consisted of four chips: the 4001, a read-only memory (ROM) chip for storing software; the 4002, a random access memory (RAM) chip for data storage; and the 4003, an input...
[November 15, 2001, 10:09]
Intel Shows Off Quad-core Chip
News Just as the bragging rights for dual-core chip supremacy are dying down, Intel gave the first glimpse of a quad-core chip coming next year. To get around some of these issues, Intel is conducting research into circuit design and chip architecture...
[February 13, 2006, 8:05]
Latest Athlon To Launch Under A Cloud
News The new package -- along with the fact that the new chip consumes about 25 percent less power than AMD's older Athlon 4 mobile processor and produces less heat as well -- will allow the 1800+ to be used in thinner and lighter notebooks.
[July 15, 2002, 10:15]
