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A Low Cost Lithography Process For Flip-Chip Applications In Advanced Packaging Industry
White Papers As in any other sector of the semiconductor industry, the electronics packaging industry is driven by the demand for packages that are ‘smaller, faster, cheaper. This paper presents a low cost thick resist manufacturing process that meets bump...
[August 14, 2003, 0:00]
Intel To Reveal Chip-packing Breakthrough
News Chip packaging is arcane, often overlooked and absolutely crucial to the future of the semiconductor industry. The increasing complexity of processors combined with the decreasing size of the chip, however, have pushed packaging to the forefront.
[October 8, 2001, 10:06]
Xeon Server Chips Delayed
News A chip packaging flaw leads Intel to hold back the release of Foster - its first ever Xeon processor based on Pentium 4 - until the end of May The chip, originally scheduled to come out on Tuesday, was delayed because of a flaw in the chip...
[May 9, 2001, 8:10]
Tessera Aims To Wrap Up IPO
News The holy grail in packaging has been to come up with multi-chip modules. In chip scale packaging, a semiconductor rests on a flexible substrate and the bundle is then wrapped in polyimide tape, Tobak said.
[October 30, 2003, 14:45]
Focus: Processor Makers' Flippin' Genius, Part II
News AMD has used flip-chip with older processors such as the K6 line, but Intel first introduced the packaging with the "Coppermine" Pentium III, launched last Autumn. At the time of the Pentium III launch, Intel told reporters the new packaging was...
[May 2, 2000, 9:12]
Via Cans C3 Processor
News The contents of this "Cool Chip In A Can" packaging, designed to stand out from competitors on retailers' shelves, will be the same as normally-boxed versions. The marketing move echoes previous products that have used unusual packaging to help...
[September 20, 2001, 10:14]
Intel Delays Launch Of Recalled PIII
News The chip had previously been available only in Intel's cartridge-like SECC2 packaging. Another consideration in 1.13GHz launch plans has to do with packaging. Intel is gearing up to launch its next-generation Pentium 4 chip as soon as next month...
[October 11, 2000, 15:23]
Intel Unveils Tillamook
News Most vendors will use the 10mm-high MMO 'mobile module' packaging but standard TCP packaging will also be available. In TCP packaging, prices are $691 and $530 respectively. Best known by its Tillamook code-name, the device is the chip giant's...
[September 8, 1997, 13:47]
IBM To Cool Layered Chips With Water
News Chips built in a three-dimensional stack formation offer more pathways for info to be processed and can shorten the distance chip information needs to travel by as much as 1,000 times, according to Thomas Brunschwiler, a senior engineer in the...
[June 5, 2008, 16:22]
3Dfx Is Getting Into The Image Game
News The campaign combines in-your-face packaging and ads created by Goody, Silverstein & Partners. For instance, the product packaging will eschew the usual technology bullet points in favour of scowling Generation Xers, said Michael Howse, vice...
[March 17, 1999, 10:08]
A Year Ago: Intel Unveils Tillamook
News Most vendors will use the 10mm-high MMO 'mobile module' packaging but standard TCP packaging will also be available. In TCP packaging, prices are $691 and $530 respectively. Intel today took the wrappers off its first MMX Pentium chip to be...
[September 7, 1998, 9:09]
Cosmic Threat To Tomorrow's Computers
Blog Back in the dawn of silicon circuitry time, SER was a big problem and it took a while to track down the source: tiny traces of radioactive contaminants in chip packaging -- well within normal environmental levels -- which were blipping alpha...
[February 4, 2008, 23:35]
AMD Renews Cheap Chip Attack
News One of the price-saving manoeuvres will be a switch from Slot A packaging to the new Socket A package. The switchover to the new packaging has already caused some confusion, as Via's KX-133 will apparently not be compatible with Slot A versions of...
[May 22, 2000, 15:03]
Intel To Boost Celeron Chip Next Year
News These include chip set technology, memory bus speed and packaging, sources said. Celeron will also adopt a new packaging design, called "flip chip", pin grid array for the 370 pin Socket 370. Flip-chip packaging moves the pins that attach the chip...
[August 20, 1999, 8:22]
When Will Intel's Coppermine Debut?
News This packaging, called "flip chip," will debut at about 500MHz. It will also allow for new packaging that returns to a socket for small form factor PCs. The design will allow for several performance improvements for the Pentium III, including...
[August 6, 1999, 8:25]
Nvidia: GeForce FX Cooler Than Ever
News In the chip's packaging and manufacturing process, Nvidia also followed its historical pattern of using cutting-edge techniques. It uses flip-chip packaging, a technique adopted in PC processors about two years ago that allows more efficient cooling.
[November 19, 2002, 10:24]
AMD Makes Its Mark On Opteron
News The logos will be used in AMD's advertising and packaging as well as ads and packaging from third parties that license the icons. A company like graphics chipmaker Nvidia could use a logo on the packaging of a graphics card to show it is compatible...
[August 12, 2003, 16:35]
Intel Stacks Up On Memory
News Most mobile phone makers use packaging that holds only one or two chips. Other flash manufacturers are working on similar packaging techniques. Clever packaging effectively allows semiconductor manufacturers to accommodate the demand for memory...
[April 10, 2003, 8:00]
US Report: Intel Chip Prices To Dip
News Intel is also designing standard mobile processor packaging to help OEMs build lighter, smaller systems. Intel's new mobile processor packaging, which it plans to release in the first half of next year, will open the door to more thin-and -light...
[July 13, 1998, 9:13]
AMD: Mid-year High-speed Chip Debut
News Thunderbird, and a forthcoming value chip from AMD -- code-named Spitfire -- will both use a new packaging called Socket A, although Thunderbird will also be available in AMD's current Slot A packaging.
[April 10, 2000, 9:02]
