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Current Trends In Flip-Chip Bonding Technique For Multichip Modules - Especially Micro-Jet Printing
White Papers Multi-chip manufacturing applies mainly wireless flip-chip bonding, which has currently many varieties. In the paper the survey of flip-chip techniques, giving their main technological features, and the area of their applications is presented.
[March 20, 2004, 23:00]
New Filter For Mobile Phones In Flip Chip Package
White Papers To meet these requirements, STMicroelectronics has created the EMIF10, a highly integrated 10-line low-pass filter in a revolutionary small flip-chip package - the equivalent of 70 discrete components on less than 7 mm2!
[May 7, 2004, 0:00]
Focus: Processor Makers' Flippin' Genius
News When Advanced Micro Devices (AMD) in the next few weeks introduces its new Duron microprocessor, the chip will be faster and cheaper partly because of a prosaic-sounding technology called flip-chip pin grid array packaging.
[May 2, 2000, 9:11]
Intel To Boost Celeron Chip Next Year
News The Pentium III offer the cartridge-like SECC2 package along with the lower cost flip-chip PGA, sources said. Celeron will also adopt a new packaging design, called "flip chip", pin grid array for the 370 pin Socket 370.
[August 20, 1999, 8:22]
Sun Doubles Server Speeds
News Such "bit flipping" problems worsen as chip features shrink because a single cosmic ray can flip two pathways' bits simultaneously, an effect that can escape the attention of error-correction technology only looking for a single flip.
[October 5, 2004, 15:15]
Nanotube Breakthrough Paves Path For Carbon Chips
News If they didn't flip off, the tubes were deemed metallic. Controlling how and when transistors flip on and off is how chips work. In the Berkeley-Stanford project, researchers created a chip, called the random access nanotube test (RANT) chip, which...
[January 8, 2004, 7:50]
IBM Allies With Stanford For Spintronics
News Further out, spintronic principles could be used to flip some kinds of transistors flip off and on. Last June, IBM and Infineon published a paper describing how the companies produced an MRAM chip on the 180-nanometre manufacturing process that...
[April 26, 2004, 10:30]
Focus: Processor Makers' Flippin' Genius, Part II
News AMD has used flip-chip with older processors such as the K6 line, but Intel first introduced the packaging with the "Coppermine" Pentium III, launched last Autumn. For example, Timna, the code name for Intel's next-generation low-cost chip, will...
[May 2, 2000, 9:12]
Toshiba Unveils Mini Microdrive
Talkback UST) is a flip Chip bumping house, we provide Eutectic bump(Eu), High Lead bump (HL)& Leadfree bump (LF) along with multi re-passivation (BCB) and multi redistribution (RDL) technology. Hello Mr. Kanellos,
[May 27, 2004, 5:02]
Sun Hypes Niagara 2 Power-efficiency
News On the flip side, the chip requires FB-DIMM (fully buffered dual inline memory modules), a more power-hungry technology than the DDR2 (double data rate 2) memory used in today's Niagara servers. Sun has been touting the efficiency of servers using...
[December 6, 2006, 8:23]
When Will Intel's Coppermine Debut?
News This packaging, called "flip chip," will debut at about 500MHz. The design will allow for several performance improvements for the Pentium III, including integrated Level 2 cache for desktop versions of the chip, lower power consumption for...
[August 6, 1999, 8:25]
2000 Roundup: Chips Broke 1GHz, But Market Yawned
News Though the newer chips might be difficult to find, they were quietly cutting manufacturing costs and boosting efficiency with new "flip-chip" packaging, which combined components such as memory cache and CPU on a single die.
[December 26, 2000, 6:10]
Intel Betting On Pentium 4
News Intel will deliver it on its current 0.18 micron manufacturing process and will utilise the FC-PGA "flip chip" package. It's in Intel and AMD's interest to get ahead and stay there," said Mike Feibus, principal at chip analyst firm Mercury Research.
[October 23, 2000, 13:45]
Cracking Open The Apple MacBook Air
Articles Common to many notebooks these days, the sound is produced by a Realtek ALC885 audio codec chip, located on the flip side of the board. Panning around the insides, we can see the main circuit board, where we will surely find the RAM, CPU and...
[March 18, 2008, 15:20]
Intel Sharpens Its Memory
News Intel's idea is to flip the floating-body cell on its side and use a design that has two gates, Mayberry said. Simply put, the floating-body cells could allow Intel to build processors with larger amounts of on-chip memory to boost performance, he...
[December 12, 2006, 7:40]
Researcher On Both Sides Of HP Bug Battle
News Adams' flip-flop from plaintiff to defendant's aide is the latest development in the odd saga, which began several years back when Adams claimed that certain floppy drive controllers were hampered by a flaw that, under particular circumstances...
[January 14, 2003, 7:42]
Behind Palm's New Network
News The Palm VII's flip-up antenna, resembling a lollipop stick that nestles along one edge of the unit, serves as an alternate power-on switch. The POMP-15 chip draws only 40 microamperes (less than one-eighth of a milliwatt) in its standby mode...
[January 15, 1999, 6:06]
A Year Ago: Behind Palm's New Network
News The Palm VII's flip-up antenna, resembling a lollipop stick that nestles along one edge of the unit, serves as an alternate power-on switch. The POMP-15 chip draws only 40 microamperes (less than one-eighth of a milliwatt) in its standby mode...
[January 15, 2000, 6:00]
Intel Heads For 3D Standards War
News I think in a sense they are flip-flopping," said Kathleen Maher, an analyst at Jon Peddie Research in San Francisco. Others go further, with some critics charging that the chip giant's decision to drop the technology reflects political rather than...
[June 21, 2004, 10:25]
AMD, And Why The $100 PC Is Inevitable
News When we set out two years ago.the decision we made was to sort of flip the company upside down in terms of priorities. To the surprise of some, the company was able to sign up IBM right away to use the new chip.
[April 28, 2005, 12:40]
