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Modeling And Analysis Of High Speed VLSI Interconnects For Digital Applications
White Papers We describe here a methodology for simulating the performance of electrical interconnects using SPICE and describe a library of models to suppport it. Increasing speed and density of VLSI technologies place increasing demands on packaging and...
[January 1, 1970, 0:59]
Integration Of High-Performance Transistors, High-Density SRAMs, And 10-Level Copper Interconnects Into A 90 Nm CMOS Technology
White Papers This paper presents a 40 nm-gate-length transistor, an ultra-high-density 6T SRAM cell, 10-level Cu interconnects, and Very-Low-K (VLK) dielectrics for high-performance microprocessor applications. The key process features are 193 nm lithography...
[January 1, 1970, 0:59]
The PCI Express Architecture And Advanced Switching: Interconnects For Converged Computing And Communications
White Papers Computing and communications technologies have advanced along with changing markets, bringing these technologies together at the silicon, board and system levels. The compute industry has evolved around a standard chip-to-chip interconnect - the...
[January 1, 1970, 0:59]
Comparing Cluster Interconnects: Fluent CFD Application Over Ethernet And InfiniBand
White Papers Adoption of commodity compute clusters has grown beyond the traditional high-performance compute market and is entering the enterprise data center. Efficiently designing cluster interconnect networks requires network professionals and cluster...
[January 1, 1970, 0:59]
France Telecom Interconnects GRX Network With Cable & Wireless
White Papers France Telecom, as part of its carriers business, signed an interconnection agreement with Cable & Wireless, in order to interconnect their GRX (GPRS Roaming Exchange) networks. France Telecom GRX network is now interconnected with more than 40...
[January 1, 1970, 0:59]
Comparing Cluster Interconnects: LS-DYNA Performance Benchmarks For Gigabit Ethernet And Cisco Double Data Rate InfiniBand
White Papers The ability of a high-performance cluster (HPC) to positively affect application performance is one of the most important factors to consider in selecting a switching fabric type and interconnect. Though the characteristics of an application affect...
[January 1, 1970, 0:59]
Technical Advancements In Ethernet Based Interconnects
White Papers Datacenter environment is different in some important ways from a generic networking environment. This presentation provides opportunities to optimize the network. DCE is one such optimization. DCE is a key optimization that improves the transport...
[January 1, 1970, 0:59]
Comparing Cluster Interconnects: Fluent CFD Over Ethernet And InfiniBand
White Papers Adoption of commodity compute clusters has grown beyond the traditional high-performance compute market and is entering the enterprise data center. Microsoft's release of a Compute Cluster edition of Windows 2003 underscores this trend.
[January 1, 1970, 0:59]
Comparing Cluster Interconnects: LS-DYNA Performance Benchmarks Over Gigabit Ethernet And Cisco InfiniBand
White Papers Application performance is one of the most significant factors in the use of clusters in High Performance Computing (HPC) environments. A number of variables affect performance, including node configuration, interconnect and switching fabric types...
[January 1, 1970, 0:59]
PCI Express And Advanced Switching: Evolutionary Path To Building Next Generation Interconnects
White Papers With processor and memory technologies pushing the performance limit, the bottleneck is clearly shifting towards the system interconnect. Any solution that addresses PCI's bus-based interconnect, which has serious scalability problems, must also...
[July 11, 2008, 0:00]
Deploying 10 Gigabit Ethernet Into HPC Clusters, Server-to-Server/Server-to-Storage Infrastructure And Workstations Over CX4 Copper Interconnects
White Papers The advent of 10 Gigabit Ethernet (10GbE) over CX4 copper cabling offers a cost-effective means of extending high-bandwidth, low-latency connectivity to many network areas requiring the added performance advantages of 10GbE.
[January 1, 1970, 0:59]
Message Passing For Linux Clusters With Gigabit Ethernet Mesh Connections
White Papers Multiple copper-based -commodity Gigabit Ethernet (GigE) interconnects (adapters) on a single host can lead to Linux cluster with mesh/torus connections without using expensive switches and high speed network interconnects (NICs).
[January 1, 1970, 0:59]
A Study Of Current Multilevel Interconnect Technologies For 90 Nm Nodes And Beyond
White Papers Technology trends of interconnects differ from those of transistors in that the performance of interconnects decreases as they are scaled down to satisfy stricter limits on line width and inter-line horizontal space.
[January 1, 1970, 0:59]
A Year Ago: Chip Firms Compete To Push Limits
News Following IBM's announcement last week of new insulated substrate technology, working in conjunction with copper interconnects to improve chip performance, AMD, Texas Instruments and Samsung have revealed more details of their innovations.
[April 16, 2001, 6:07]
Low-Cost Wafer Bumping
White Papers As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping processes have been developed to produce the small solder features required for this interconnects technology.
[January 1, 1970, 0:59]
Hitachi Storage Central And Storage Area Networks
White Papers Storage area networks (SANs) are based upon storage protocols and interconnects that enable “any-to-any” connectivity between servers and storage. However, until recently, the UNIX® and NT worlds have not been able to implement SANs due to the...
[January 1, 1970, 0:59]
RF Over Ethernet For Wireless Infrastructure
White Papers Existing interconnects between RF and processing hardware have been tightly integrated at a system bus level or have incorporated proprietary network hardware, usually tied to the particular data being transported.
[July 4, 2008, 1:00]
Comparing Linux Clusters For The Community Climate System Model
White Papers In this paper, the authors examine the performance of two components of the NCAR Community Climate System Model (CCSM) executing on clusters with a variety of microprocessor architectures and interconnects.
[January 1, 1970, 0:59]
Intel Researches Nanotubes For Chip Designs
News The chip giant has managed to create prototype interconnects — microscopic metallic wires inside chips that link transistors — out of carbon nanotubes and measure how well the interconnects perform. Chip interconnects have become a looming headache...
[November 13, 2006, 10:59]
IBM Finds Gold In Copper
News The chips use copper instead of aluminium to bridge the gaps, or interconnects, between their transistors. AMD recently announced that it had produced prototype K6 processors with copper interconnects in its Dresden, Germany, fabrication plant.
[September 24, 1999, 9:27]
