High Optical Density Photomasks For Large Exposure Applications
White Papers Since the introduction of projection lithography in semiconductor manufacture, photomasks have been coated with 800 Å to 1000 Å of Cr film to achieve an OD of 3.0 ± 0.2 at g, h and i-line Mercury (Hg) wavelengths.
[April 30, 2004, 0:00]
Intel: One Step Closer To 10GHz
News The chipmaker announced Thursday that it has delivered the first standard-format photomasks for use with Extreme Ultraviolet (EUV) lithography. These new photomasks are critical to the success of EUV because they represent the technology necessary...
[March 9, 2001, 8:38]
Toshiba Goes Straight On Chip Design
News The consortium -- which includes Dai Nippon Printing, DuPont Photomasks, Etec systems, Applied Materials, KLA-Tencor, Numerical Technologies, PDF Solutions, Tensilica and Virtual Silicon Technology -- will hold its first public meeting June 19 in...
[June 5, 2001, 9:05]
Welcome To The Ink-jet Age
News Existing circuit board manufacturing techniques rely upon the use of photomasks and acid etching, neither of which are required by ink jet printers which produce circuit boards using an additive process.
[January 6, 2006, 17:15]
