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IBM Adds Zip To PowerPC Chips
News IBM is ready to enter production with a new performance-enhancing microprocessor technology, called "silicon-on-insulator," the company announced Monday. IBM claims the addition of silicon-on-insulator, or SOI, can increase a processor's...
[May 23, 2000, 8:13]
US Report: IBM Chips As Smooth As Ice
News On Monday, IBM plans to unveil a new "silicon-on-insulator" processor technology that makes the basic building block of silicon chips -- the transistor -- more efficient. The insulator makes a thin "friction-less" channel, through which electrical...
[August 3, 1998, 9:40]
AMD Reveals Futuristic Transistor Designs
News The chipmaker's researchers have created and demonstrated a new Fully Depleted Silicon-on-Insulator transistor, the company said on Wednesday. The silicon-on-insulator design technique uses special materials to better isolate transistors inside a...
[April 3, 2003, 7:48]
Toshiba Finds 'nothing' Makes A Better Transistor
News The idea is similar to silicon-on-insulator (SOI), an established technique developed in the 1970s and widely used by most manufacturers. Here, a thin layer of insulator keeps electrical charge from building up around a transistor and altering its...
[December 5, 2001, 17:07]
IBM's Chip Future May Woo Sun
News The new technology is believed to be a variation of the silicon-on-insulator (SOI) developments that IBM has been working on for some time. The new IBM process alters the way silicon behaves by placing a layer of insulator underneath a layer of...
[February 7, 2006, 15:35]
IBM To Share Chip Intelligence
News Under terms of the alliance, announced late Monday, Sony and Toshiba will be able to incorporate some of IBM's chip-making advances, such as Silicon on Insulator, into future processors for consumer-electronic devices.
[April 2, 2002, 15:27]
IBM Combination Technique Speeds PC Chips
News Silicon on insulator, a technique pioneered by IBM, was one of the first technologies developed to contain the energy problem. The company has managed to combine both strained silicon and a silicon insulator into the same wafer.
[September 9, 2003, 16:55]
IBM Powers Up 90-nanometre Process
News To make the new PowerPCs, IBM is combining layers of silicon on insulator (SOI) and strained silicon. IBM has long been the primary proponent of silicon on insulator technology, which functions like a sponge.
[February 13, 2004, 8:10]
AMD Strains For Processor Improvements
News In its first paper, AMD described how it achieved a 30 percent performance improvement in transistor speed by incorporating two changes into experimental transistors: a nickel silicide transistor gate and adding a fully depleted silicon-on...
[June 12, 2003, 9:03]
AMD And IBM Deepen Chip Commitment
News IBM for years has been at the forefront of chip research, pioneering techniques such as silicon-on-insulator, but it sells far fewer chips than companies like Intel. AMD derived early benefit from the deal when IBM helped unwind problems AMD was...
[September 22, 2004, 8:30]
Smaller Is Better, Says AMD Chief
News Silicon-on-insulator, or SOI, technology has been in development for some time at companies including AMD and IBM; it adds a layer of insulation underneath a transistor inside a processor. The next step, Ruiz said, is the implementation of low...
[June 27, 2000, 8:11]
AMD Unveils Triple-gate Transistor
News Intel's Prescott chip, shipping to computer manufacturers later this year, will contain strained silicon, but Intel has yet to adopt silicon on insulator, which advocates say cuts down on leakage. By contrast, AMD and IBM are already selling chips...
[September 19, 2003, 11:20]
IBM To Produce Nvidia Chips
News The graphics chipmaker will not use IBM's more exotic manufacturing technologies -- such as the silicon-on-insulator technique, which helps reduce power consumption and boost performance -- at first, but may use them in the future.
[March 26, 2003, 7:39]
Printable Semiconductors Move A Step Closer
News Ong's group will conduct experiments on spraying the conductor and insulator materials. Xerox has also developed two other designer molecules: one that acts like a conductor, which transmits electricity, similar to how a metal works; and one that...
[April 19, 2004, 11:35]
IBM Confronts Sun In Unix Face-off
News They're the first midrange Unix servers to use CPUs with IBM's silicon-on-insulator (SOI) technology, which allows faster speeds without higher temperatures. IBM will announce new midrange Unix servers on Monday amid a tightening market that has...
[April 23, 2001, 12:45]
Motorola Brings Server Technology To The Desktop
News The enhancements come from a newer manufacturing process that includes silicon on insulator (SOI), which has chiefly been a feature in high-end server chips. The process places an insulator between a transistor and the silicon bed that a transistor...
[January 29, 2002, 14:14]
Optimization Of Silicon Technology For The IBM System Z9
White Papers IBM 90-nm Silicon-On-Insulator (SOI) technology was used for the key chips in the System z9 processor chipset. Along with system design, optimization of some critical features of this technology enabled the z9 to achieve double the system...
[January 1, 1970, 0:59]
Reliability Results Of A New EEPROM/Flash Memory Cell
White Papers A unique non-volatile (NV) memory cell has been developed based on silicon on insulator technology. Cell options with writing voltages between 6 and 10 V will be discussed along with the impact which writing voltage has on reliability.
[January 1, 1970, 0:59]
Hybrid Integration Of Light Emitters And Detectors With SOI Based Micro-Opto-Electro-Mechanical Systems (MOEMS)
White Papers The approach taken by the consortium to overcome this issue is to use the single-crystal-silicon (SCS) device layer of a Silicon-on-Insulator (SOI) wafer for the primary structural layer. Since optical flatness and mechanical reliability are of...
[January 1, 1970, 0:59]
IBM To Hit 1GHz With PowerPC Chip
News This combines recent chipmaking innovations -- including copper wires, silicon-on-insulator (SOI) technology and low-capacitance dielectrics -- with a 130-nanometer (0.13-micron) manufacturing process.
[October 15, 2001, 10:35]
